Wafer thickness measurement device
It is equipped with transfer functionality and thickness measurement functionality.
This is a wafer thickness measurement device equipped with transfer and thickness measurement functions. It is capable of measuring the thickness at each point within the specified wafer. It supports 6-inch and 8-inch wafers. 【Features】 ■ Equipped with transfer and thickness measurement functions ■ Supports 6-inch and 8-inch wafers ■ Capable of measuring up to 2000 points (Thickness measurement points can be set arbitrarily) ■ Equipped with real-time monitoring function for acquired data
- Company：レイリサーチ
- Price：10 million yen-50 million yen
